STMicroelectronics LSM6DSV320XTR Datasheet
The LSM6DSV320XTR is a state-of-the-art, high-g embedded AI 6-axis Inertial Measurement Unit (IMU) engineered by STMicroelectronics. Designed specifically for high-impact tracking and advanced motion sensing, it combines a 3-axis digital low-g accelerometer (± 2 to ± 16 g), a 3-axis digital high-g accelerometer (up to ± 320 g), and a 3-axis digital gyroscope (± 250 to ± 4000 dps).
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Part Number: LSM6DSV320XTR
Manufacturer: STMicroelectronics
Stock: 1k pcs
Date Code: 26+
Package: LGA14
Technical Specifications Table
The table below outlines key parameters critical for hardware engineering and procurement compliance:
| Parameter | Specification |
| Manufacturer | STMicroelectronics |
| Operating Temperature Range | -40°C to +85°C (Industrial Grade) |
| Core Supply Voltage (V_DD) | 1.71V to 3.6 V (1.8 V Nominal) |
| I/O Voltage (V_DDIO) | 1.08V to 3.6 V |
| Low-g Accelerometer Range | ± 2g, ± 4 g, ± 8 g, ± 16 g |
| High-g Accelerometer Range | ± 32 g, ± 64 g, ± 128 g, ± 256 g, ± 320 g |
| Gyroscope Range | ± 250 dps, ± 500 dps, ± 1000 dps, ± 2000 dps, ± 4000 dps |
| Communication Interfaces | SPI / I²C / MIPI I3C v1.1 (Primary & Auxiliary) |
| Package / Case | LGA-14L (2.5 mm x 3.0 mm x 0.83 mm) |
| Environmental Compliance | RoHS compliant, ECOPACK lead-free |
Key Functional Highlights & Architecture
Quad-Channel Processing Architecture: The LSM6DSV320X features specialized hardware channels running simultaneously: Channel 1 for user interface data processing, Channel 2 for Optical Image Stabilization (OIS), Channel 3 for Electronic Image Stabilization (EIS), and Channel 4 dedicated to high-g acceleration processing.
Edge AI Processing: Featuring an integrated Machine Learning Core (MLC) and Finite State Machine (FSM), the device shifts motion-tracking algorithms off the main host processor. This drastically cuts system-level energy consumption for always-on context awareness.
High-Impact Shock Detection: The dedicated high-g channel supports shock tracking up to $\pm320$ g. This makes it an essential component for high-impact analysis, car crash detection, athletic performance monitoring, and severe concussion logging.
Supply Chain Insights & Availability
Standard factory lead times for STMicroelectronics MEMS sensors typically range from 12 to 18 weeks depending on global fab capacities.
To assist procurement teams with inventory buffering, ICHOME maintains ready-to-ship stock of LSM6DSV320XTR in tape-and-reel packaging (LGA-14L). We offer same-day dispatch and express worldwide delivery.
Alternative Parts & Direct Replacements of LSM6DSV320XTR
When sourcing components during supply chain pinches, consider these options:
LSM6DSV16XTR (Functional Equivalent): Comparison: Sharing similar embedded MLC and FSM architecture, the LSM6DSV16X caters to standard IMU applications. However, it lacks the specialized high-g dual accelerometer (± 320 g capability) present in the LSM6DSV320XTR.
LSM6DSL / LSM6DSOX (Legacy / Drop-in Alternatives): Comparison: Well-established 6-axis IMUs for basic motion tracking. While pin layout considerations must be verified for your schematic, they offer strong availability for standard mobile and IoT applications.
Applications of ST LSM6DSV320XTR
Automotive & Asset Monitoring: Event Data Recorders (EDRs), asset tracking tags, structural health monitoring (SHM) for infrastructure.
Personal Protective & Medical Equipment: Concussion measurement devices, severe fall/impact detection, and wearable safety gear.
Consumer Electronics & Gaming: Smartphones, wearables, smart tags, and high-precision gaming controllers.
What Is the Main Difference Between LSM6DSV16X and LSM6DSV320XTR?
The primary difference lies in the high-g sensing capability. While the LSM6DSV16X is a standard 6-axis IMU limited to ± 16 g, the LSM6DSV320XTR incorporates a dual-accelerometer setup capable of measuring extreme shocks up to ± 320 g. This makes the LSM6DSV320XTR uniquely suited for crash reconstruction, fall severity, and high-impact applications.
Package Information of LSM6DSV320XTR
Package Type: LGA-14L (14-lead Land Grid Array)
Dimensions: 2.5mm x 3.0mm x 0.83 mm (Max height)
Pin Pitch: 0.5 mm
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